展会新闻

2017/04/28

1589

欢迎参加6月27日上海先进功率半导体研讨会

Advanced 

Power Semiconductors

 

先进功率半导体研讨会信息概览

富士电机藤岛直人主持

PCIM Asia诚邀您的参与

 

❂   Schedule   

Tuesday afternoon,27 June 2017

❂    Location   

Meeting room 2 in the Floor B2 of Shanghai World Expo Exhibition and Convention Center

❂ Chairperson

Naoto Fujishima 

Fuji Electric, Japan

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14:00

DIPIPMTM for 

Automotive Application

 

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Yazhe Wang

Mitsubishi Electric Corporation Power Device Works, Japan

This paper presents the Dual In-line Package Intelligent Power Module (DIPIPMTM) family that dedicated for Electric Vehicle (EV) and Hybrid Electric Vehicle (HEV) air-conditioner inverter drive applications. The DIPIPMTM product family that targeted for automotive applications adopted the advanced CSTBTTM power chip technology and embedded in to Mitsubishi Electric’s unique insulation-sheet type transfer mold package that is capable to provide the excellent electrical characteristics and superior reliability for automotive application. By using the optimized wafer and assembly process, the DIPIPMTM achieved a package size that small enough to be able to dramatically shrink the compressor mounting space. Examples of DIPIPMTM in air-conditioner inverter drive application for electric vehicle that targeted for long drive range and heavy passenger load are introduced.

14:25 

Upgrading of output power by 

newly developed 7th generation 

IGBT and package technologies  

 

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Song Chen

Fuji Electric (China) Co., Ltd, China

The newly developed products family of 7th generation IGBT module so called Dual XT which housing is widely used in worldwide. Advanced technologies in this paper achieve over 30% upgrading of current of current rating of the product which can create significant benefit for power conversion systems.

14:50

IGBT5 Based Power Module for high 

efficient PFC and inverter applications  

 

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Ding Wu

Vincotech GmbH, China

Nowadays, High efficiency for power electric conversion is more and more important. With higher efficiency, you can reduce the loss of power devices, have more compact design, and save system cost. One way is to use expensive SIC components, the other is to use much cheaper Si-based IGBT with multi-level topologies. This article will introduce IGBT-5 based power modules to have high efficiency but with reasonable cost.

15:15
Coffee Break

 

 

15:30 

Performance Evaluation of Split 

NPC 3L Modules for 1500VDC 

Central Solar Inverter up to 1.5MW

 

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Wei Jing

Semikron Electronics (Zhu Hai) Co. Ltd. Shenzhen Branch, China

To pursue a lower system cost and a higher power generation efficiency, sola power industry is heading to the direction of 1500VDC system. As key devices for the system, solar inverters must be able to handle the DC input voltage as high as 1500V, and have a power capacity above 1MW which is expected by the inverter manufactures for power density and cost reasons. This paper presents the performance of new designed split NPC 3L modules together with a built up inverter solution that is designed dedicatedly to meet the new demand of 1500VDC solar inverters. By splitting the NPC 3L topology into top and bottom parts, a powerful built up 3L leg can be achieved, which has 1200V blocking voltage and 1200A chip current. The switching characteristics of each IGBT and diode are measured on a built up 3L inverter by using the well-known double pulse test method. Furthermore, the inverter is tested with full power on a back to back inverter test bench. Testing and simulation results verify that the split NPC 3L inverter is capable to output 750A RMS current at 5kHZ switching frequency with and efficiency of 98.7%, which means more that 750kW output power at 600VCA without module paralleling and 1.5MW with 2 pairs of modules in parallel. Compared with the traditional 3 half bridge modules build up solution, the introduced split NPC 3L solution has one less module and much easier bus bar design, which can lead to a compact and cost effective inverter design.

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